Thermal Interface Materials Market Size to Reach $3.57 Billion USD by 2025:...

Thermal Interface Materials Market Size to Reach $3.57 Billion USD by 2025: Global Business Opportunities, Industry Survey, Market Size, Competitive Trends, Competitor and Forecast Report

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Aug 16, 2020 (Market Insight Reports) —
Thermal interface materials are defined as materials with high thermal conductivity. It acts as an interface material for dissipating heat generated from a heat source to the heat sink. Transportation industry is one of the major driving factors of global thermal interface materials market growth due to electrification.

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The transport industry is somehow responsible for the emission of greenhouse gas and world energy use in large amount. Now vehicles are as vehicles are comprising of more and more electronic and electrical components in it the thermal management and energy use have become more and more vital. Greases are still used extensively as thermal materials in the automotive industry.

Thermal grease is a compound normally used as a substrate material between the heat sink and heat sources of the device. This grease is thermally conductive in nature. But it is electrically insulating. It is also referred as heat paste, thermal gel, thermal paste, etc. The thermal grease helps in increasing the heat transfer between the interface areas of the component. It helps to remove air gaps between them. However, there are some hindering the growth of the market as well. Some of the major factors hampering the thermal interface materials market are high usage of thermal interface materials and Performance limited by physical properties. The bulk resistance method may unpleasantly affect the growth of the Global Thermal interface materials market.

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The primary factor contributing towards the global thermal interface material industry growth are rapid expansion of medical industry and electronics industry in developing countries. In addition, the increasing popularity of electric vehicles is likely to have an impact to the overall growth of the Global thermal interface materials market over the forecast period. Thermal interface materials are used to increase the thermal coupling between the devices. Thermal interface materials are used in a number of industrial sectors. The increasing applications of thermal interface materials are accelerated by the development of new technologies and innovations.

Global thermal interface materials market can be split on the basis of various segments such as type, application, companies and key geographies. On the basis of product type, thermal interface materials can be segmented into Metal-based, Phase change materials, Greases & adhesives, Elastomeric pads, Tapes & films, and other. Thermal interface materials are used many application such as Automotive electronics, Consumer durables, Industrial machinery, Medical devices, Computer, Telecom, and others.

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There are major leading players which are currently functioning in Global Thermal interface materials market. Some of the key players or Manufacturers involved in the Market are Dow Corning, Henkel AG & Company KGaA, Honeywell International Inc., Laird Technologies, 3M, Parker Hannifin Corp, SEMIKRON, Inc., DK Thermal Metal Circuit Technology Ltd., Indium Corporation, Wakefield-Vette, and many others.

Looping on the basis of key geographies the Global Thermal interface materials market can be divided into North America (U.S. and Canada), Asia Pacific (India, Japan, China and Rest of APAC), Europe (France, UK, Germany and Rest of Europe), Central and South America (Brazil, Mexico and Rest of Central & South America), Middle East and Africa and Rest of World (RoW).

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Key segments of the global thermal interface materials market

Product Overview, 2015-2025 (USD Million)

  • Tapes & Films
  • Elastomeric pads
  • Greases & Adhesives
  • Phase Change Materials
  • Metal-Based

Application Overview, 2015-2025 (USD Million)

  • Telecom
  • Computer
  • Medical Devices
  • Industrial Machinery
  • Consumer Durables
  • Automotive Electronics

Regional Overview, 2015-2025 (USD Million)

  • North America
  • S.
  • Canada
  • Europe
  • France
  • Germany
  • UK
  • Rest of Europe
  • Asia Pacific
  • India
  • Japan
  • China
  • Rest of APAC
  • Latin America
  • Brazil
  • Rest of Latin America
  • Middle East and Africa
  • Saudi Arabia
  • Rest of Middle East and Africa

Key Players analysed in the report include

  • SEMIKRON
  • Wakefield-Vette, Inc.
  • DK Thermal Metal Circuit Technology Ltd.
  • Indium Corporation
  • Parker Hannifin Corp
  • Others

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